PITTSBURGH, Oct. 15, 2012 /PRNewswire/ -- To meet market demands for low-power mobile, high-performance computing and consumer and automotive electronics, ANSYS (NASDAQ: ANSS) and subsidiary Apache announce that their simulation tools have been selected for TSMC's 20-nanometer (20nm) Reference Flow and CoWoSTM (Chip on Wafer on Substrate) Reference Flow to meet power, noise and reliability requirements for ensuring timely and successful tape-out results.
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As part of the TSMC 20nm Reference Flow, Apache made needed enhancements in its RedHawk™ tool to provide IR-drop and electromigration (EM) analysis based on 20nm process requirements such as current direction and power grid rule of DC EM.
TSMC's CoWoS™ Reference Flow spans a suite of tools from ANSYS and Apache to manage thermal impact on 3D-IC structures, such as thermal run-away, stress and thermal-induced electromigration. RedHawk, Totem, Chip Thermal Model (CTM™) and Sentinel™-TI, along with ANSYS® SIwave™ and ANSYS Icepak®, provide complete system-level thermal analysis with consideration for chip behavior across CoWoS™ designs. Another key advantage of 3D-IC packaging is the support for Wide-I/O architecture, which enables the design of products with lower power and higher bandwidth data communication. The CoWoS™ Reference Flow includes Sentinel™-SSO interposer-based I/O jitter and timing simulation with package and board models extracted from SIwave, providing designers with accurate and early visibility of
their chip's performance.
"ANSYS and Apache solutions address power, noise and reliability challenges for the most advanced TSMC process nodes and emerging design technologies," said Andrew Yang, president of Apache. "Our continued collaboration with TSMC enables us to provide optimized tools and methodologies for 20nm and CoWoS™ designs."
"Using ANSYS and Apache solutions, customers will have the ability to produce more robust designs and quickly deliver their next-generation products to the marketplace with TSMC's 20nm and CoWoS™ technologies," said Suk Lee, TSMC senior director, design infrastructure marketing division.
To learn more about the broad portfolio of engineering simulation product offerings, visit ANSYS and Apache exhibiting at the TSMC Open Innovation Platform® Ecosystem Forum October 16 in San Jose, Calif. Apache will present "Verification of Power, Signal and Reliability Integrity for 3D-IC/Silicon Interposer Designs" during the EDA technical track.
About Apache Design, Inc.
Apache Design, an ANSYS subsidiary, enables simulation-driven IC and electronic systems design by providing advanced chip-level power analysis, optimization, and sign-off solutions. Apache's integrated products and methodologies advance low-power innovation and address chip-package-system power and noise challenges. Using Apache's engineering simulation software early in the design and throughout the process enables the world's top semiconductor companies to gain a competitive advantage delivering more power-efficient, high-performance, and noise immune chips. Apache's products help lower power consumption, increase operating performance, mitigate design risks, reduce system cost, and shorten time-to-market for a broad range of end-markets and applications. Learn more at:
About ANSYS, Inc.
ANSYS brings clarity and insight to customers' most complex design challenges through fast, accurate and reliable engineering simulation. Our technology enables organizations ― no matter their industry ― to predict with confidence that their products will thrive in the real world. Customers trust our software to help ensure product integrity and drive business success through innovation. Founded in 1970, ANSYS employs more than 2,300 professionals, many of them expert in engineering fields such as finite element analysis, computational fluid dynamics, electronics and electromagnetics, and design optimization. Headquartered south of Pittsburgh, U.S.A., ANSYS has more than 65 strategic sales locations throughout the world with a network of channel partners in 40+ countries. Visit www.ansys.com for more information.
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